Courses
Courses:
IME 156 Basic Electronics Manufacturing
Course Description:
Practical electronics manufacturing knowledge expanded through concepts such as CAD/CAM design, Design for Manufacture (DFM), documentation requirements, prototyping and production planning. Hands-on techniques learned for project planning, soldering, automation, hand tool usage and production methods. 1 lecture, 1 laboratory.
Course syllabus
Lecture notes ( Note: you will be directed to Blackboard, where the online content of my courses resides.)
IME 157 Electronics Manufactuirng
Course Description:
Printed circuit board assembly; printed circuit board fabrication process; electronics packaging; overview of semiconductor manufacturing; design, documentation and fabrication of electronic units with emphasis on CAD/CAM. Open to all majors. 2 lectures, 2 laboratories.
Course syllabus
Lecture notes ( Note: you will be directed to Blackboard, where the online content of my courses resides.)
IME 326 Engineering Test Design and Analysis
Course Description:
Data gathering and statistical testing applied to industrial engineering and manufacturing fields. Experimental methods for product and process evaluation and comparisons; interpretation of engineering data. Engineering experimental design, linear and nonlinear regression, ANOVA, and multifactor ANOVA. Utilization of existing computer software. 4 lectures. Prerequisite: STAT 321 with a grade of C- or better.
Lecture notes ( Note: you will be directed to Blackboard, where the online content of my courses resides.)
IME 335 Computer-Aided Manufacturing
Course Description:
Wire-frame, surface, and solid model generation. Benefits, limitations, and selection of CAD and CAM systems. CAD as an input to CAM. Manual, language-based, and graphics-based NC programming. Configuration of CAD/CAM software; post-processor generation. 3 lectures, 1 laboratory. Course syllabus
Lecture notes ( Note: you will be directed to Blackboard, where the online content of my courses resides.)
IME 427 Process Optimization through Designed Experiments
Course Description:
Experiments for optimization of industrial processes: process variables, response, measurements, analysis and interpretations. Statistical principles in design. Design approaches: conventional methods, response surface methodology, and Taguchi methods. Type of experiments: factorial,fractional factorial, mixture, and orthogonal arrays. Design projects using real world problems. 3 lectures, 1 laboratory. Prerequisite: IME 326 or consent of instructor.
IME458 Microelectronics and Electronics Packaging
Course Description: Materials, Processes, and Reliability of microelectronics and electronics packaging, surface mount assembly and printed circuit board fabrication. Overview of semiconductor manufacturing and optoelectronics packaging. Open to all majors. 3 lectures & 1 laboratory. Prerequisite: MATE 210 and PHYS 133, or consent of instructor.
IME 507 Graduate Seminar
Course Description: Selected topics of interest to industrial engineering, integrated technology management, and engineering management graduate students. The Schedule of Classes will list topic selected. Total credit limited to 4 units, with a maximum of 2 units per quarter. 1 seminar, 1 laboratory. Prerequisite: Graduate standing or consent of instructor.The Multidisciplinary Project-based Learning Program NetPRL Project
Tutorials:
PCB Design and Manufacturing Tutorials
Minitab Tutorials for Design and Analysis of Experiments
My Graduate Students:
Tzu-Chien (Jason) Chou, "Effect of Reflow Profile on Lead-free Solder Joint Shear Force", (2006). Currently Procurement Quality Engineer with IBM.
Brian S. Wright, "Designing and Manufacturing Microelectronic Packages for High-Power Light-Emitting Diodes", Co-advised with Dr. Richard Savage, (2007). Currently Electrical Engineer with Agilent Technologies.
Andrew J. Farris, "Drop Impact Reliability Testing Lead-free Chip Scale Packages", Co-advised with Dr. Albert Liddicoat, (2008). Currently Research Scientist with Lockheed Martin Aeronautics.
Minh-Nhat Ba Le, "Advanced Thermosonic Wire Bonding using High Frequency Ultrasonic Power: Optimization, Bondability, and Reliability", (2009). Currently Senior Design Engineer at Western Digital.
Michael S. Krist, "The Design and Manufacture of a Light Emitting Diode Package for General Lighting," (2010). Currently Industrial Engineer at Defense Microelectronics Activity.
Christopher Grasberger, "The Study of the Forward-Voltage to Junction-Temperature Coefficient Degradation in Light-Emitting Diodes," (2010). Currently with Seesmart.
Ronald Sloat, in progress