Lead-Free Soldering

Electronics Manufacturing

Wire Bonding

LED

Lead-Free Soldering:

Consortium:

• National Electronics Manufacturing Initiative (NEMI)

• National Center for Manufacturing Sciences (NCMS)

• High Density Packaging Users Group (HDPUG)

• Joint Group on Pollution Prevention (JGPP)

• Computer Aided Life Cycle Engineering (CALCE)

• Tin Technology

• IPC lead-free

Electronics Manufacturing:

Technical Societies:

• International Microelectronics and Packaging Society

• IEEE Components, Packaging and Manufacturing Technology (CPMT) Society

• Surface Mount Technology Association

• IPC

• SME Electronics Manufacturing Technical Group

Technical Journals:

• IEEE Transactions on Electronics Packaging Manufacturing

• IEEE Transactions on Advanced Packaging

• IEEE Transactions on Components and Packaging Technologies

• ASME Journal of Electronic Packaging

• IMAPS Journal of Microelectronics and Electronic Packaging

• SMTA Journal of Surface Mount Technology

• Emerald Journal, Soldering & Surface Mount Technology

• Microelectronics Reliability

Technical Magazines:

• SMT

• Advanced Packaging

• Circuits Assembly

• Semiconductor International

• Solid State Technology

• Photonics Spectra

Reference Books:

• Fundamentals of Microsystems Packaging, Rao R. Tummala, McGraw-Hill; 2001 (ISBN 0-07-137169-9)

• Fundamentals of Microfabrication, The Science of Miniaturization, Marc J Madou (ISBN 0-8493-0826-7)

• Electronic Materials Handbook (Volume 1 Packaging), ASM International (ISBN 0-87170-285-1)

• The Science and Engineering of Microelectronic Fabrication, 2nd Ed., Oxford University Press, S. A. Campbell, (ISBN 0-19-513605-5)

• The Electronic Packaging Handbook, Glenn Blackwell, editor, CRC Press and IEEE Press, 2000 (ISBN 0-8493-8591-1)

• Fundamentals of Semiconductor Fabrication, May and Sze, Wiley, 2004 (ISBN 0-471-23279-3)

Wire Bonding:

Wire Bonder Manufacturers:

• F&K Delvotec

• Orthodyne Electronics

• K&S

• ESEC

• Palomar Technologies

Bonding Tools (Wedge and Capillary):

• Small Precision Tools

• K&S

• Gaiser Tool Company

• DeWeyl Tool, Inc.

Bonding Wires:

• Williams Advanced Materials

• American Fine Wire (K&S)

• Tanaka Precision

References:

• Wire Bonding in Microelectronics Material, Processes, Reliability, and Yield, George Harman, McGraw-Hill; 1997 (ISBN 0-07-032619-3)

• Wire Bonding Challenges in Optoelectronics Packaging

LED:

LED Companies:

• Philips Lumileds

• Cree

• Nichia

• Osram

• Seoul Semiconductor

• General LED

LED Organizations:

• DOE Solid State Lighting

• RPI’s Lighting Research Center

• LED Magazine

Thermal Management of LED:

• Electronics Cooling magazine

• FloEFD

• QLed (a good thermal modeling tool when LUXEON LEDs are used)

• Thermal Wizard