My research interests are in LED Packaging, Lead-free soldering, and Microelectronics & Electronic Packaging.
Presentations at National/International Conferencess:
“The Effect of Ultrasonic Frequency on Gold Wire Bondability and Reliability,” 41st International Symposium on Microelectronics (IMAPS’2008), Providence, RI, Nov. 2-6, 2008.
“The Effect of Temperature on Lead-free Solder Joint Reliability,” invited lecture at 8th International Business & Technology Summit for Thermal Management of Electronics, Natick, MA, August 20-21, 2008.
“A Project-Based Electronics Manufacturing Laboratory Course for Lower-division Engineering Students,” 2008 American Society for Engineering Education Annual Conference & Exposition, Pittsburgh, PA, June 22-25, 2008.
“Drop Test Reliability of Lead-free Chip Scale Packages,” the 58th IEEE Electronic Components and Technology Conference, Lake Buena Vista, Florida, May 27 - 30, 2008.
“Effects of Reflow Profile and Thermal Shock on Intermetallic Compound Thickness for SnPb and SnAgCu Solder Joints,” the IPC Printed Circuits Expo, APEX and the Designers Summit 2007, Los Angeles, CA, Feb. 20-22, 2007.
“Investigation of the Lead-free Solder Joint Shear Performance,” the 39th International Symposium on Microelectronics, San Diego, CA, October 8-12.
“Estimation of Liquidus Temperature when SnAgCu BGA/CSP Components are Soldered with SnPb Paste,” the 7th IEEE International Conference on Electronics Packaging Technology, Shanghai, China, August 26-29, 2006.
“Lead Free Soldering Backward Compatibility,” the 12th IPC/JEDEC International Conference on Lead Free Electronic Components and Assemblies, Santa Clara, CA, March 7-9, 2006.
“Effect of Reflow Profile on SnPb and SnAgCu Solder Joint Shear Force,” the IPC Printed Circuits Expo, APEX and the Designers Summit 2006, Anaheim, CA, Feb. 8-10, 2006.
“Lead-Free Solder Joint Reliability – State of the Art and Perspectives,” the 37th International Symposium on Microelectronics (IMAPS’04), Long Beach, CA, Nov. 2004.
“Wire/Ribbon Bonding Challenges in Optoelectronics Packaging,” the 1st SME Annual Manufacturing Technology Summit, Dearborn, MI, August 2004.
“Effect of Chromium-Gold and Tantalum-Tantalum Nitride-Platinum-Gold Metallization on Wire/Ribbon Bondability,” the 29th IEEE/CPMT/SEMI International Electronics Manufacturing Technology Symposium, San Jose, CA, July 2004.
"A Study of Solder Paste Deposition Process in the Stencil Printing," 1999 ASME International Mechanical Engineering Congress and Exposition, Nashville, Tennessee, November 14-19, 1999.
"Critical Variables of Solder Paste Stencil Printing for micro-BGA and Fine Pitch QFP," 25th IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium, Austin, TX, October 18-20, 1999.
"Gauge Repeatability & Reproducibility Study for a 3-D Solder Paste Inspection System," the 32nd International Symposium on Microelectronics, Chicago, Illinois. October 26-28, 1999.
“Design of Experiments for Fine Line Thick Film Screen Printing,” IMAPS Keystone Chapter Symposium, Bethlehem, PA, June 17, 1999.
“Experimental Study of Solder Paste Stencil Printing for Fine Pitch and Ultra-Fine Pitch QFP and BGA,” the 13th Conference with Industry: Competing in a Global Manufacturing Environment, Lehigh University, May 24 & 25, 1999.
“Screen Printing Process Design of Experiments for Fine Line Printing of Thick Film Ceramic Substrate,” the 31st International Symposium on Microelectronics, San Diego, CA, November 1-4, 1998.
"Modeling of Solder Paste Stencil Printing for Fine Pitch and Ultra-fine Pitch Surface Mount Assembly," 1998 IMAPS Keystone Chapter Symposium, Bethlehem, PA, May 13, 1998.
"Development of Plant-Oriented CAPP System," the 11th Conference with Industry: Strategic Technologies for Global Manufacturing, Lehigh University, April 28 & 29, 1997.
Invited Talks at Universities, Companies, and Professional Society Chapters :
Philips Lumileds Lighting Company, San Jose, CA, August 13, 2008.
Teledyne Microelectronics, Los Angeles, CA, August 6, 2008.
Surface Mount Technology Association Silicon Valley Chapter, San Jose, CA, June 19, 2008.
American Vacuum Society Northern California Chapter, San Jose, CA, June 11, 2008.
Shanghai Jiao Tong University, China, School of Microelectronics, August 1, 2007.
Agilent Technologies, Santa Clara, CA, November 8, 2006.
Foxconn, San Jose, CA, July 30, 2006.
JDS Uniphase, Milpitas, CA, March 24, 2006.
SMTA Silicon Valley Chapter, March 23, 2006.
Solectron Corp., Milpitas, CA, August 2005.
Solectron Corp., Milpitas, CA, June 2005.
SME, Automated Manufacturing and Assembly Community Town-hall Meeting, October, 2004.
Siemens, Atlanta, GA, the 1st conference of the Consortium for the Advancement of Electronics Manufacturing Education, June 2004.
Solectron Corp., Milpitas, CA, June 2004.
America Ceramics Society, IEEE/CPMT and IMAPS San Diego Chapter, March 23, 2004.
Kyocera America, San Diego, CA, March 23, 2004.
Texas A&M University, Department of Engineering Technology & Industrial Distribution, March 17, 2003.
Cal Poly, San Luis Obispo, CA, Department of Industrial and Manufacturing Engineering, March 11, 2003.
New Mexico State University, Department of Industrial Engineering, January 21, 2003.
University of Miami, Department of Industrial Engineering, November 22, 2002.
Tsinghua University, Beijing, China, Department of Precision Instrument, December 23, 1999.
Visteon Corporation, Lansdale, PA, November 1999.
IMAPS Keystone Chapter, March 18, 1999.
National Science Foundation (NSF), "Enhancing Student Learning Through State-of-the-Art Systems Level Design and Implementation," PI: Al Liddicoat, Co-PI:
Jianbiao Pan, Collaborator: Jim Harris, $199,030, 2007-2010
Office of Naval Research through Cal Poly, "Effect of Reflow Profile and Metallization on Lead-free Solder Joint Reliability," PI: Jianbiao Pan, $55,394, 2005-2006
Society of Manufacturing Engineers Education Foundation, "Effect of Component Finish and PCB Surface Finish on Lead-free Solder Joint Quality,", PI: Jianbiao Pan, $14,994, 2005-2006
Cal Poly Center for Teaching and Learning, "Integration of State-of-the-Art Electronic Design Automation Tools into the Electronics Manufacturing Curriculum", PI: Jianbiao Pan, Co-PI: Al Liddicoat, $2,572, 2005.
Office of Naval Research through Cal Poly, "Reliability Study of Lead-free Solder Joints," PI: Jianbiao Pan, $60,750, 2004-2005.
Fellow, International Microelectronics and Packaging Society, 2009.
1st Place, IPC’s worldwide Academic Poster Competition, March 31 – April 2, 2009, Las Vegas, NV.
Invitee, National Academy of Engineering Frontiers of Engineering Symposium, 2007.
Highly Commended Winner, the Emerald Literati Network Awards for Excellence 2007, for the paper titled "The effect of reflow profile on SnPb and SnAgCu solder joint shear strength" published in Soldering & Surface Mount Technology, Vol. 18, No. 4, pp. 48-56, 2006.
M. Eugene Merchant Outstanding Young Manufacturing Engineer Award, the Society of Manufacturing Engineers (SME), 2004.
Best Paper in Session, J. Pan, R. M. Pafchek, F. F. Judd, and J. Baxter, “Effect of Chromium-Gold and Tantalum-Tantalum Nitride-Platinum-Gold Metallization on Wire/Ribbon Bondability,” IEEE/CPMT/SEMI 29th International Electronics Manufacturing Technology Symposium, San Jose, CA, 2004
Graduate Student of the Year, Dept. of Industrial & Systems Engineering, Lehigh University, 2000.
First Prize for Student Poster, IMAPS Keystone Chapter, 1999.
Outstanding Student Officer Award, SME Region 3, 1998.
Graduate Fellowship, Lehigh University, 1996 – 1997.
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